Tyndall National Institute invites applications to a full time 12 month postdoc researcher position in the Materials Modelling for Devices group, headed by Dr. Michael Nolan, to investigate new thermal, self-limiting atomic layer etch chemistries using multiscale atomistic simulations.
Reporting to the Head of Group – Materials Modelling for Devices in the Tyndall MicroNanoSystems Centre, the researcher will be responsible for leading the work on using multi-scale simulations to model novel thermal atomic layer etching chemistries. The position is supported by a Semiconductor Research Corporation (SRC) project supported by Intel.
The overall aim of this project is to explore the chemistry of self-limiting thermal atomic layer etching (tALE) which is being deployed for precise, controlled etching of a range of materials with a view to applying this in the fabrication of next generation semiconductor devices where complex 3D structure and ultra thin films are required. While there has been some significant advances in thermal ALE and the MMD group at Tyndall has pioneered the atomistic simulation of thermal ALE of metal oxides and metals, there are still many open questions. This project aims to understand the role of surface orientation, surface defects and terminations, find alternatives to HF and develop libraries of tALE process chemistries.
The role requires a strong background and PhD in chemistry/materials/sold state physics, focussed on simulation of surface chemistry and relevant processes. In addition, some experience with programming and machine learning will be a significant benefit.
As part of this role the candidate will take training and development opportunities at Tyndall and UCC to drive their wider training and career development.